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S7 Empacotamento Eletrônico |
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Title:
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THE INFLUENCE OF THE DISTANCE BETWEEN PLATES IN AN ARRAY OF VERTICAL PRINTED CIRCUIT BOARDS COOLED BY NATURAL CONVECTION: NUMERICAL AND EXPERIMENTAL ANALYSIS
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Summary :
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ABSTRACT. ARRAYS OF VERTICAL CHANNELS FORMED BY PARALLEL PLATES ARE FREQUENTLY ENCOUNTERED IN NATURAL CONVECTION COOLING OF ELECTRONIC EQUIPMENT. IN SUCH APPLICATIONS, FOR AN ALLOWABLE MAXIMUM TEMPERATURE RISE, THE HEAT DISSIPATED FROM A CHANNEL DECREASES WITH DECREASING SPACING, BUT THE TOTAL NUMBER OF PLATES INCREASES. HENCE, THERE IS AN OPTIMUM SPACING BETWEEN PLATES THAT MAXIMIZES THE HEAT DISSIPATION PER UNIT VOLUME. IN THE PRESENT STUDY, NUMERICAL AND EXPERIMENTAL INVESTIGATIONS OF AN OPTIMUM SPACING WERE CARRIED OUT IN AN ARRAY OF FIBER GLASS PLATES WITH RESISTORS DISCRETELY DISTRIBUTED ON THEIR SURFACES. UNIFORM HEATING TESTS WITH VARIATION OF POWER AND DISTANCES AMONG PLATES WERE PERFORMED. IN THE NUMERICAL ANALYSIS, ENERGY BALANCES FOR THE COMPONENTS WERE FORMULATED AND THE HEAT DIFFUSION EQUATION IN TWO-DIMENSIONAL CARTESIAN COORDINATES SYSTEM AND STEADY STATE CONDITIONS WAS NUMERICALLY SOLVED. THE CONCEPT OF "BUOYANCY INDUCED FORCED CONVECTION" WAS APPLIED TO THE RESISTORS, WHERE FORCED CONVECTION HEAT TRANSFER COEFFICIENTS WERE EMPLOYED. GOOD AGREEMENT BETWEEN NUMERICAL AND EXPERIMENTAL RESULTS WAS OBSERVED.
KEY WORDS: NATURAL CONVECTION, OPTIMUM SPACING, PRINTED CIRCUIT BOARDS, VERTICAL CHANNELS
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Author :
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Avelar, Ana Cristina
Ganzarolli, Marcelo Moreira
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Paper View :
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