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S7 Empacotamento Eletrônico |
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Title:
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UTILIZATION OF THERMOELECTRIC DEVICES FOR COOLING ELECTRONIC EQUIPMENT INSTALLED IN CABINETS
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Summary :
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ABSTRACT. THE PROCEDURE EMPLOYED IN THE DESIGN OF A THERMAL CHAMBER TO BE CONSTRUCTED USING THERMOELECTRIC COOLERS IS DESCRIBED IN DETAIL. THE CHAMBER WAS DESIGNED IN ORDER TO CREATE A SUITABLE MICROCLIMATE FOR APPROPRIATE OPERATION OF ELECTRONIC EQUIPMENT INSTALLED INSIDE A SHELTER FOR TELECOMMUNICATION APPLICATIONS. SPECIAL ATTENTION IS DEFERRED TO THE SELECTION OF THERMOELECTRIC COOLERS AND TO THE DEFINITION OF MOUNTING POSITIONS OF THE COOLERS ON THE HEATSINKS. A STUDY WAS CONDUCTED TO ANALYZE THE THERMAL AND HYDRODYNAMIC CONDITIONS INSIDE THE CHAMBER. THIS STUDY WAS BASED ON COMPUTER SIMULATIONS CARRIED OUT USING THE PROGRAM AUTOFLOW ?A COMPUTATIONAL FLUID MECHANICS TOOL. RESULTS OF THESE SIMULATIONS ARE SHOWN AND DISCUSSED.
KEY WORDS. THERMOELECTRIC COOLERS, ELECTRONIC DEVICES COOLING, TELECOMMUNICATION CABINETS.
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Author :
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Velásquez, Jos?Antonio
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Paper View :
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