The purpose of
this Symposium is to congregate papers in the multidisciplinary field of
mechanical engineering associated to Electronic Packaging. It has applications
in the electric-electronics industries in the design, manufacturing and
assembly of components, equipment and systems.
The topics were
selected similarly to some specific International
Conferences
with this theme that occur abroad. They reflect the wide range of the themes
and the importance of Mechanical Engineering in these activities known
as Electronic Packaging.
Scientific
Committee:
Carlos
Alberto Carrasco Altemani (FEM,
UNICAMP)
Marcelo
Moreira Ganzarolli (FEM
- UNICAMP)
Jose
Antonio Velasquez Alegre (CEFET
- PR)
Ricardo
Alan Verdu Ramos (UNESP
- FEIS - DEM)
Carlos
Kenichi Suzuki (UNICAMP
- FEM)
Luis
Fernando Azevedo (PUC -
Rio - DEM)
Márcio
Tarozzo Biasoli (CTI - IM)
Jurandir
Itizo Yanagihara (USP -
POLI - DEM)
Marcus
Bianchi (UFRGS - DEM)
José
Maria Galvez (UFMG
- DEMEC)
César
J. Deschamps (UFSC
- DEM)
